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Achieving Legal and Financial Closure If you are a consultant, it is time to get the sign-o that the project is complete, deliver the nal bill, and get paid. Do not forget to pay your sub-contractors. These procedures can be simple or complex, depending on the nature of the bureaucracy involved, the size of the project, and the quality of your nancial record-keeping. But, obviously, they cannot be set aside for later or forgotten. If they are, nal collections can take costly months. In addition to the formal closure, informal closure is also important. Some executives have a hard time saying, job well done, or thanks. But, at least give them the chance to do it. If you are a working as a consulting rm, this is a good time to make sure that you have whatever references or recommendations you wanted to get out of the contract. If you work internally, corporate communications might announce the new product or service, or even include a short article from a satis ed customer in a corporate newsletter. If you have done well, a little celebration is in order.

Accuracy Elements of machine tools Elements of measuring equipment (length, roughness)

Ultra-precision differential transformers, electromagnetic proximity sensors, laser interference optical Doppler, optical sensors Electron X-ray scintillators, ions (SEM, TEM, STEM, IMA), multi-reflection laser interferometer (cube)

Project overview with eld de nitions (Continued).

Surface analysis (structure)

You don t have to be a rocket scientist to figure out why this happens. It s these kinds of predictions that get Wall Street s attention. It s like a love dance between Wall Street and management as they whisper sweet nothings to each other. Management wants the top analysts to follow the company and recommend its stock. Wall Street wants a winner to make analysts look good and attract more money. But there is no reality in all this. It s all delusion.

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Include the name and title, role, or specialty of anyone being considered for the project. If they are de nitely on board (they and their boss agree) then list D in the third column, otherwise list P. This list is of team members only. A similar list for stakeholders appears on page 5.

High-precision DC servo motors (closed loop), predicting controls, electromagnetic servo actuators (thermal and electrostatic), mini-computers Electrostriction and magnetostriction servos, super high speed electronic computers (sequence, process, unattended systems)

001 m

Options being considered Any unresolved issues of architecture, scope, or the inclusion of speci c features are listed here. Identify the options and which stakeholders prefer which options. Attach decision matrices where appropriate. As a decision is made regarding each option, move it from here to the Goal and Inclusions section. Decisions may be made during concept, analysis, or design stages, but should be complete by the end of design.

Monostructure elastic spring guideways, electromagnetic or electrostatic line movement guideways, thermal deformation line movement guideways Electrostatic and electromagnetic deflection, electrostrictive and magnetostrictive line movements

Notes towards a support plan Any information you receive from stakeholders regarding documentation and training for operations support sta or the help desk should go here. Identify new tools they might need to learn and new applications with which they might need to work.

Reactive abrasive grains, lapping plates, lapping liquids, ions, laser, electrons, X-rays, photo-resist (E)

* Carol J. Loomis, Reporter Assoc., Fortune, February 5, 2001.

Notes towards a test plan Any information prioritizing tests as most crucial or most likely to run into trouble. Any issue regarding user tests, end-to-end testing, or technical test plans, so that it can be included in the test and quality plans.

EEM, mechanochemical lapping, reactive lapping, laser heat treatment, PVD (physical vapor deposition), electron beam exposure, SOR exposure Non-contacting lapping, ion machining, sputter etching, reactive etching, sputter deposition, ion plating, ion implantation Substance synthesizing processing (atomic or molecular arrays, molecular beam machining)

Computer simulation, finite element method, modal analysis (stress)

Table 5-3 Project overview with eld de nitions (Continued).

Digital control (quantity, sequence)

page 4 Project name:

ion microprobe analyzer transmission electron microscope elastic emission machining chemical vapor deposition synchrotron orbital radiation cubic boron nitride

scanning electron microscope scanning transmission electron microscope electron probe microscope physical vapor deposition electro discharge machining charge coupled device

Milestone(s) For each project stage, a complete list of deliverables, and a list of who will approve those deliverables.

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